1. ʻO ka hana mana kiʻekiʻe a me ke kumu kūʻai haʻahaʻa o ka uila:
nā pūnaewele hoʻokō kiʻekiʻe me ka ʻenehana hoʻopihapiha holomua, ka mana hoʻopuka modula alakaʻi i ka ʻoihana, ʻoi loa ka mana wela coefficient -0.34%/℃.
2. Hiki i ka mana nui ke hiki i 565W+:
hiki ke piʻi ka mana o ka module i 565W+.
3. hilinaʻi kiʻekiʻe:
nā pūnaewele ʻoki ʻole luku + ʻenehana wiliwili nui-busbar/super multi-busbar.
E pale pono i ka pilikia o nā māwae micro.
Hoʻolālā paʻa paʻa.
E hoʻokō i nā koi hoʻouka o 5400Pa ma mua a me 2400Pa ma hope.
Hoʻohana maʻalahi i nā hiʻohiʻona noiʻi like ʻole.
4. Hoʻemi haʻahaʻa loa:
Attenuation o 2% i ka makahiki mua, a attenuation o 0.55% makahiki ma ka makahiki mai 2 a 30 makahiki.
Hāʻawi i ka loaʻa kālā no ka wā lōʻihi a paʻa i nā mea kūʻai aku.
Ka hoʻohana ʻana i nā cell anti-PID a me nā mea hoʻopihapiha, hoʻohaʻahaʻa haʻahaʻa.
1. nā kaʻa kaʻa he nui:
Hoʻolaha nui ʻia nā laina laina, a ua like ka ikaika, a ua hoʻonui ʻia ka mana o ka hoʻolālā multi-busbar ma mua o 5W.
2. hou welding uwea:
Me ka hoʻohana ʻana i ka lipine uea poepoe, ua hoʻemi ʻia ka wahi malu.
Hōʻike ʻia ke kukui hanana i nā manawa he nui, e hoʻonui ana i ka mana e 1-2W.
3. Kiekie Density Packaging Technology:
Ke hoʻohana nei i ka ʻenehana paʻi kiʻekiʻe kiʻekiʻe.
Hōʻoiaʻiʻo i ke kaulike kūpono o ka pono a me ka hilinaʻi.
Ua hoʻonui ʻia ka pono o ka module ma mua o 0.15%.
ʻO kā mākou huahana nui nā panela lā, nā kukui alanui o ka lā, nā ʻeke hoʻopaʻa ikehu, nā mea hoʻohuli, nā uea a me nā kaula, nā pahu mika, nā pale photovoltaic, a me nā ʻoihana lawe mai a me nā ʻoihana ʻē aʻe.Kūʻai nui ʻia kā mākou huahana i nā ʻāina e like me ʻEulopa, ʻAmelika, Asia Hema, a me ʻApelika.Loaʻa ka huahana i nā palapala hōʻoia CE, UL, TUV, a me INMETRO.Loaʻa iā mākou nā hale hana hui like ʻole e hiki ke hana i nā kikoʻī like ʻole a me nā hiʻohiʻona o nā huahana e like me nā koi o ka mea kūʻai aku.I ka manawa like, loaʻa iā mākou kahi hui noiʻi a me ka hoʻomohala holomua, e hoʻoikaika nei e noho ma ke alo o ka ʻoihana.